Application of agglomerative granulation to plant seeds (part 2). Pelleting of organic plant seeds
DOMARADZKI M., KANIEWSKA J., WEINER W.
Please cite as: CHEMIK 2012, 66, 5, 473-478
The application of granulation process for encapsulation of organic seeds was studied. The best composition of material for encapsulation turned out to be a dust mixture containing: 33% kaolin, 50% dolomite and 17% of wood dust. Application of combination of three processes: washing, encapsulation and inoculation with spores of fungus Trichoderma viride gave the best germination results of tested Umbelliferae seed. Negative effect of drying on the survival rate of spores of Trichoderma viride was observed. This makes necessity to increase the dose of the inoculum.
Keywords: Trichoderma viride, organic seeds, seeds pelleting